{"id":10717,"date":"2024-09-14T13:55:52","date_gmt":"2024-09-14T05:55:52","guid":{"rendered":"https:\/\/www.ray-tron.com\/?p=10717"},"modified":"2024-09-14T13:55:52","modified_gmt":"2024-09-14T05:55:52","slug":"ale0055","status":"publish","type":"post","link":"https:\/\/www.ray-tron.com\/en\/ale0055\/","title":{"rendered":"What issues should be paid attention to in the production process of photovoltaic welding ribbon"},"content":{"rendered":"

existPhotovoltaic welding ribbon<\/a>During the production process, special attention should be paid to the following key issues to ensure that the quality and performance of the soldering tape meet the requirements:<\/p>\n

1. Selection of raw materials<\/strong><\/p>\n

Purity of copper substrate: The base material of the soldering ribbon is usually high-purity copper because copper has good conductive properties. It is necessary to select high-quality, high-purity copper substrate to ensure conductivity and durability.<\/p>\n

Tinning quality: The tinning layer is the key part of the solder strip, which affects the soldering performance and corrosion resistance. The uniformity, thickness and finish of the tinning layer are very important and must be strictly controlled.<\/p>\n

2. Wire drawing process<\/strong><\/p>\n

In the early stage of photovoltaic ribbon production, copper wire is stretched into thin wires through a wire drawing process. During the wire drawing process, it is necessary to control the wear of the wire drawing die, ensure that the diameter of the copper wire is uniform, and avoid breakage or damage of the copper wire.<\/p>\n

3. Annealing<\/strong><\/p>\n

The annealing process keeps the copper substrate at a suitable softness for easy soldering. The annealing temperature and time must be strictly controlled to avoid excessive hardening or softening of the copper wire, which will affect the final soldering performance.<\/p>\n

4. Tinning process<\/strong><\/p>\n

The key to the tinning process is to control the thickness and uniformity of the tinning layer. A tinning layer that is too thin will result in poor welding performance, while a tinning layer that is too thick will increase costs. During the process, the electroplating time, current density, and plating solution composition must be strictly monitored to ensure that the coating is uniform and free of bubbles or impurities.<\/p>\n

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