When producing small-sized copper-clad aluminum strips, due to their small size, higher requirements for process control are required, so some specific quality problems are prone to occur. The following are some common aspects:<\/p>
Problem description: In small-size products, due to the small bandwidth and thickness, it is more difficult to control the uniformity of the copper layer, and it is easy for the local copper layer to be too thin or too thick.<\/p>
Impact: If the copper layer is too thin, it will lead to insufficient conductivity and increased local resistance; if it is too thick, it may affect overall flexibility and cost control.<\/p>
Problem description: Due to the reduction in size, the metallurgical bonding of the copper layer and the aluminum core is more susceptible to process fluctuations, and localized shedding or delamination of the copper layer may occur.<\/p>
Impact: A loose bond will reduce the mechanical strength and durability of the product, and increase the risk of breakage or poor contact during long-term use.<\/p>
Problem description: During the cutting and drawing process of small-sized products, burrs, cracks or irregular edges are easily formed on the edges.<\/p>
Impact: Edge defects not only affect the appearance, but may also cause poor welding or mechanical damage during subsequent processing and installation.<\/p>
Problem description: Due to the high precision requirements of the processing technology, scratches, pits or oxidation spots may appear on the surface of small-sized copper-clad aluminum strips.<\/p>
Impact: Surface defects can affect solder joint quality, which can degrade electrical performance and overall reliability.<\/p>
Problem description: During the drawing and rolling process of small-sized products, internal stress is more likely to concentrate, which may cause deformation or cracking of the product during subsequent use.<\/p>
Impact: Deformation and cracking not only reduce the mechanical stability of the product, but may also cause electrical failure of the solder joints.<\/p>
Problem description: Small-sized products are more sensitive to process parameters (such as temperature, pressure, drawing speed, etc.), and any slight fluctuation may cause unstable product indicators.<\/p>
Impact: Poor consistency between batches may lead to uneven product quality and affect the stability of large-scale production.<\/p>
Prevention and improvement measures<\/p>
Precision equipment and automated control: High-precision automated production lines and online detection systems are used to monitor key indicators such as copper layer thickness and bonding quality in real time to ensure the uniformity and consistency of small-size products.<\/p>
Process optimization: Optimize key processes such as drawing, rolling and annealing, especially the precise control of temperature and pressure to reduce internal stress concentration and processing defects.<\/p>
Strict quality management: Establish a strict quality control system and traceability system, and conduct detailed inspections on each batch of products (including electrical, mechanical and surface quality tests) to ensure that the products meet the standard requirements.<\/p>
Personnel training: Strengthen operator training, improve process operation level, and reduce process fluctuations caused by human factors.<\/p>
Research and develop new processes: Continuously develop and introduce new technologies, such as high-temperature calendering and precision drawing technology, to meet the requirements of smaller-sized products for higher process precision.<\/p>