{"id":33468,"date":"2025-03-11T16:54:42","date_gmt":"2025-03-11T08:54:42","guid":{"rendered":"https:\/\/www.ray-tron.com\/?p=33468"},"modified":"2025-03-11T16:54:49","modified_gmt":"2025-03-11T08:54:49","slug":"how-does-ruichuang-solve-the-problem-of-incomplete-bonding-of-the-copper-layer-of-copper-clad-aluminum-strip","status":"publish","type":"post","link":"https:\/\/www.ray-tron.com\/en\/how-does-ruichuang-solve-the-problem-of-incomplete-bonding-of-the-copper-layer-of-copper-clad-aluminum-strip\/","title":{"rendered":"How does Ruichuang solve the problem of incomplete bonding of the copper layer of copper-clad aluminum strip?"},"content":{"rendered":"
Copper clad aluminum strip asPhotovoltaic welding ribbon<\/a>The copper layer is a high-quality alternative material with significant advantages in weight, cost and conductivity. However, the industry generally has the problem of incomplete copper layer bonding, which makes the copper layer easy to peel off, affecting the welding effect and long-term reliability.Raytron<\/a>As a leading domesticCopper Clad Aluminum Strip Manufacturer<\/a>, through technological breakthroughs, successfully solved this key problem.<\/p> Industry difficulties with incomplete copper layer bonding<\/p> Traditional processes have bonding layer defects:<\/p> Due to the large differences in the physical and chemical properties of copper and aluminum, it is difficult to ensure the close bonding between the copper layer and the aluminum core using ordinary copper cladding processes, and it is easy to form air gaps or bonding layer defects.<\/p> Copper layer peeling problem:<\/p> When the copper-clad aluminum strip with incomplete bonding is bent, welded or used for a long time, the copper layer may peel off, resulting in loose welding and affectingPhotovoltaic modules<\/a>long-term stability.<\/p> Unstable welding performance:<\/p> Incomplete bonding will affect thermal conductivity and wettability during welding, reduce welding quality and increase the risk of component failure.<\/p> Ruichuang's technological breakthrough<\/p> Ruichuang uses high temperature diffusion bonding + precision rolling technology to form a solid alloy bonding layer between the copper layer and the aluminum core through metallurgical diffusion process, completely eliminating the risk of peeling. This bonding method is more stable and durable than traditional mechanical bonding or electroplating methods.<\/p> The industry generally has the problem of copper layer being too thin or uneven in thickness, which leads to reduced conductivity. Ruichuang uses high-precision rolling and coating technology to control the thickness of the copper layer within the optimal range and ensure that the copper layer evenly covers the entire aluminum core, improving conductivity and durability.<\/p> Through non-oxidation surface treatment and ultra-precision edge cutting process, the surface of Ruichuang's copper-clad aluminum strip is smooth and burr-free, which improves the wettability and reliability during welding and ensures the stability of photovoltaic module welding.<\/p>